{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,1,7]],"date-time":"2025-01-07T05:33:00Z","timestamp":1736227980506,"version":"3.32.0"},"reference-count":28,"publisher":"MDPI AG","issue":"10","license":[{"start":{"date-parts":[[2016,10,24]],"date-time":"2016-10-24T00:00:00Z","timestamp":1477267200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"name":"the National Key Basic Research Special Fund of China","award":["Grant No. 2015CB057205"]},{"DOI":"10.13039\/501100001809","name":"the National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["Grant No. 51305179"],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"the Program for Changjiang Scholars and Innovative Research Team in University","award":["No. IRT13017"]},{"name":"the Natural Science Foundation of Jiangsu Province","award":["No. BK20160183"]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Sensors"],"abstract":"<jats:p>Acoustic micro imaging has been proven to be sufficiently sensitive for micro defect detection. In this study, we propose a sparse reconstruction method for acoustic micro imaging. A finite element model with a micro defect is developed to emulate the physical scanning. Then we obtain the point spread function, a blur kernel for sparse reconstruction. We reconstruct deblurred images from the oversampled C-scan images based on l1-norm regularization, which can enhance the signal-to-noise ratio and improve the accuracy of micro defect detection. The method is further verified by experimental data. The results demonstrate that the sparse reconstruction is effective for micro defect detection in acoustic micro imaging.<\/jats:p>","DOI":"10.3390\/s16101773","type":"journal-article","created":{"date-parts":[[2016,10,24]],"date-time":"2016-10-24T14:46:39Z","timestamp":1477320399000},"page":"1773","source":"Crossref","is-referenced-by-count":5,"title":["Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging"],"prefix":"10.3390","volume":"16","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1525-9157","authenticated-orcid":false,"given":"Yichun","family":"Zhang","sequence":"first","affiliation":[{"name":"State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China"}]},{"given":"Tielin","family":"Shi","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China"}]},{"given":"Lei","family":"Su","sequence":"additional","affiliation":[{"name":"Jiangsu Key Laboratory of Advanced Food Manufacturing Equipment and Technology, Jiangnan University, Wuxi 214122, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9675-8147","authenticated-orcid":false,"given":"Xiao","family":"Wang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China"}]},{"given":"Yuan","family":"Hong","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China"}]},{"given":"Kepeng","family":"Chen","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China"}]},{"given":"Guanglan","family":"Liao","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China"}]}],"member":"1968","published-online":{"date-parts":[[2016,10,24]]},"reference":[{"key":"ref_1","doi-asserted-by":"crossref","first-page":"246","DOI":"10.1109\/TSM.2014.2309591","article-title":"Rapidly void detection in TSVs with 2-D X-ray imaging and artificial neural networks","volume":"2","author":"Wang","year":"2014","journal-title":"IEEE Trans. Semicond. Manuf."},{"key":"ref_2","doi-asserted-by":"crossref","first-page":"1245","DOI":"10.1109\/TCPMT.2014.2322907","article-title":"Void Detection in TSVs with X-ray image multithreshold segmentation and artificial neural networks","volume":"7","author":"Wang","year":"2014","journal-title":"IEEE Trans. Compon. Packag. Manuf."},{"key":"ref_3","doi-asserted-by":"crossref","first-page":"484","DOI":"10.1016\/j.ndteint.2011.05.003","article-title":"A novel approach for flip chip solder joint inspection based on pulsed phase thermography","volume":"6","author":"Lu","year":"2011","journal-title":"NDT E Int."},{"key":"ref_4","doi-asserted-by":"crossref","first-page":"1580","DOI":"10.1007\/s10854-011-0487-6","article-title":"Extending acoustic microscopy for comprehensive failure analysis applications","volume":"10","author":"Brand","year":"2011","journal-title":"J. Mater. Sci. Mater. Electron."},{"key":"ref_5","doi-asserted-by":"crossref","first-page":"280","DOI":"10.1016\/j.ndteint.2007.10.013","article-title":"Detection of delaminations in sub-wavelength thick multi-layered packages from the local temporal coherence of ultrasonic signals","volume":"4","author":"Martin","year":"2008","journal-title":"NDT E Int."},{"key":"ref_6","doi-asserted-by":"crossref","first-page":"011207","DOI":"10.1117\/1.JMM.13.1.011207","article-title":"Scanning acoustic gigahertz microscopy for metrology applications in three-dimensional integration technologies","volume":"13","author":"Brand","year":"2014","journal-title":"J. Micro\/Nanolithogr. MEMS MOEMS"},{"key":"ref_7","doi-asserted-by":"crossref","first-page":"499","DOI":"10.1038\/nature16066","article-title":"Ultrafast ultrasound localization microscopy for deep super-resolution vascular imaging","volume":"7579","author":"Errico","year":"2015","journal-title":"Nature"},{"key":"ref_8","first-page":"6447","article-title":"Acoustic super-resolution with ultrasound and microbubbles","volume":"18","author":"Viessmann","year":"2016","journal-title":"Phys. Med. Biol."},{"key":"ref_9","doi-asserted-by":"crossref","first-page":"9","DOI":"10.1016\/j.ultras.2015.12.006","article-title":"Evaluation of near-surface stress distributions in dissimilar welded joint by scanning acoustic microscopy","volume":"67","author":"Kwak","year":"2016","journal-title":"Ultrasonics"},{"key":"ref_10","doi-asserted-by":"crossref","first-page":"183","DOI":"10.1016\/j.ymssp.2012.08.005","article-title":"Using BP network for ultrasonic inspection of flip chip solder joints","volume":"32","author":"Su","year":"2013","journal-title":"Mech. Syst. Signal Process."},{"key":"ref_11","doi-asserted-by":"crossref","first-page":"16281","DOI":"10.3390\/s131216281","article-title":"Defect inspection of flip chip solder bumps using an ultrasonic transducer","volume":"12","author":"Su","year":"2013","journal-title":"Sensors"},{"key":"ref_12","doi-asserted-by":"crossref","first-page":"351","DOI":"10.1016\/j.ultras.2011.10.001","article-title":"Sparse signal representation and its applications in ultrasonic NDE","volume":"3","author":"Zhang","year":"2012","journal-title":"Ultrasonics"},{"key":"ref_13","doi-asserted-by":"crossref","first-page":"271","DOI":"10.1109\/TADVP.2005.853553","article-title":"Advanced acoustic microimaging using sparse signal representation for the evaluation of microelectronic packages","volume":"29","author":"Zhang","year":"2006","journal-title":"IEEE Trans. Adv. Packag."},{"key":"ref_14","doi-asserted-by":"crossref","first-page":"373","DOI":"10.1109\/TUFFC.2014.006769","article-title":"Cluster-enhanced sparse approximation of overlapping ultrasonic echoes","volume":"2","author":"Mor","year":"2015","journal-title":"IEEE Trans. Ultrason. Ferroelectr. Freq. Control"},{"key":"ref_15","doi-asserted-by":"crossref","first-page":"1191","DOI":"10.1109\/TUFFC.2014.3018","article-title":"A linear model approach for ultrasonic inverse problems with attenuation and dispersion","volume":"7","author":"Carcreff","year":"2014","journal-title":"IEEE Trans. Ultrason. Ferroelectr. Freq. Control"},{"key":"ref_16","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1016\/j.ultras.2015.12.011","article-title":"Sparse deconvolution method for ultrasound images based on automatic estimation of reference signals","volume":"67","author":"Jin","year":"2016","journal-title":"Ultrasonics"},{"key":"ref_17","doi-asserted-by":"crossref","first-page":"10540110","DOI":"10.1088\/0957-0233\/26\/10\/105401","article-title":"A model-based regularized inverse method for ultrasonic B-scan image reconstruction","volume":"26","author":"Wu","year":"2015","journal-title":"Meas. Sci. Technol."},{"key":"ref_18","doi-asserted-by":"crossref","first-page":"9324","DOI":"10.3390\/s150409324","article-title":"A sparse reconstruction algorithm for ultrasonic images in nondestructive testing","volume":"4","author":"Guarneri","year":"2015","journal-title":"Sensors"},{"key":"ref_19","doi-asserted-by":"crossref","first-page":"582","DOI":"10.1109\/6144.814975","article-title":"Resolution of broadband transducers in acoustic microscopy of encapsulated ICs: Transducer selection","volume":"4","author":"Canumalla","year":"1999","journal-title":"IEEE Trans. Compon. Packag. Technol."},{"key":"ref_20","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1016\/j.ndteint.2015.11.007","article-title":"Characterization of micro-crack propagation through analysis of edge effect in acoustic microimaging of microelectronic packages","volume":"79","author":"Lee","year":"2016","journal-title":"NDT E Int."},{"key":"ref_21","doi-asserted-by":"crossref","first-page":"25601","DOI":"10.1088\/0957-0233\/27\/2\/025601","article-title":"Finite element modelling for the investigation of edge effect in acoustic micro imaging of microelectronic packages","volume":"27","author":"Lee","year":"2016","journal-title":"Meas. Sci. Technol."},{"key":"ref_22","doi-asserted-by":"crossref","first-page":"2762","DOI":"10.1016\/j.microrel.2015.08.005","article-title":"Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry","volume":"12","author":"Lee","year":"2015","journal-title":"Microelectron. Reliab."},{"key":"ref_23","unstructured":"Lee, C.S. (2014). Numerical Study for Acoustic Micro-Imaging of Three Dimensional Microelectronic Packages. [Ph.D. Thesis, Liverpool John Moores University]."},{"key":"ref_24","doi-asserted-by":"crossref","unstructured":"Efrat, N., Glasner, D., Apartsin, A., Nadler, B., and Levin, A. (2013, January 29). Accurate blur models vs. image priors in single image super-resolution. Proceedings of the IEEE International Conference on Computer Vision (ICCV), New York, NY, USA.","DOI":"10.1109\/ICCV.2013.352"},{"key":"ref_25","doi-asserted-by":"crossref","unstructured":"Krishnan, D., Tay, T., and Fergus, R. (2011, January 20). Blind deconvolution using a normalized sparsity measure. Proceedings of the IEEE Computer Vision and Pattern Recognition (CVPR), Providence, RI, USA.","DOI":"10.1109\/CVPR.2011.5995521"},{"key":"ref_26","doi-asserted-by":"crossref","first-page":"183","DOI":"10.1137\/080716542","article-title":"A fast iterative shrinkage-thresholding algorithm for linear inverse problems","volume":"2","author":"Beck","year":"2009","journal-title":"SIAM J. Imaging Sci."},{"key":"ref_27","doi-asserted-by":"crossref","first-page":"42","DOI":"10.1016\/j.jvcir.2015.08.017","article-title":"Bi-l0-l2-norm regularization for blind motion deblurring","volume":"33","author":"Shao","year":"2015","journal-title":"J. Vis. Commun. Image Represnet."},{"key":"ref_28","doi-asserted-by":"crossref","first-page":"1271","DOI":"10.1121\/1.3675002","article-title":"Sparsity driven ultrasound imaging","volume":"21","author":"Tuysuzoglu","year":"2012","journal-title":"J. Acoust. Soc. Am."}],"container-title":["Sensors"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/www.mdpi.com\/1424-8220\/16\/10\/1773\/pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,6]],"date-time":"2025-01-06T23:52:52Z","timestamp":1736207572000},"score":1,"resource":{"primary":{"URL":"https:\/\/www.mdpi.com\/1424-8220\/16\/10\/1773"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,10,24]]},"references-count":28,"journal-issue":{"issue":"10","published-online":{"date-parts":[[2016,10]]}},"alternative-id":["s16101773"],"URL":"https:\/\/doi.org\/10.3390\/s16101773","relation":{},"ISSN":["1424-8220"],"issn-type":[{"type":"electronic","value":"1424-8220"}],"subject":[],"published":{"date-parts":[[2016,10,24]]}}}  <script>parent.window.postMessage('ixistenz.url:https://api.crossref.org/works/10.3390%2FS16101773', '*'); </script> <div id='browserdiffcontainer' style='position: fixed; right: 10px; top: 10vh; min-width: 60px;  border: 1px solid white; background: rgb(251, 189, 0);; opacity: 0.9; font-family: helvetica, arial, sans serif;  font-size: 12px; z-index: 20001; padding-bottom: 20px;'><div onclick="toggle('browserdiffcontainerlist'); return false;" style='background: rgb(151, 89, 0);; color: white; '><strong>&nbsp; <span class='glyphicon glyphicon-minus'></span> NODES</strong></div><div id='browserdiffcontainerlist' style='padding-left: 10px; padding-right: 5px; max-height: 50vh; overflow: auto; '><div><a href='#diffid123' style='color: white;' onClick="parent.window.postMessage('ixistenz.opendiff:123', '*');; return false;" style='text-decoration: none; '>INTERN </a> <a style='color: white;' href='#diffid123'><sup>1</sup></a></div></div></div>
<script>
function toggle( divname ) {
  var x = document.getElementById( divname );
  if (x.style.display === 'none') {
    x.style.display = 'block';
  } else {
    x.style.display = 'none';
  }
} </script>