Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Arizona, since 2005, when it was moved from West Chester, Pennsylvania, also in the United States.[5] The company's Arizona headquarters was originally in Chandler,[6] then later moved to Tempe. The company was founded in 1968 and, as of 2022[update], has approximately 31,000 employees worldwide and a reported $7.1 billion in sales.
 | |
| Company type | Public |
|---|---|
| ISIN | US0316521006 |
| Industry | Semiconductors & Related Devices |
| Founded | 1968 |
| Founder | Hyang-Soo Kim |
| Headquarters | Tempe, Arizona, U.S. |
Number of locations | 12 |
Key people |
|
| Revenue |  US$6.50 billion (2023) |
| US$470 million (2023) | |
| US$362 million (2023) | |
| Total assets | US$6.77 billion (2023) |
| Total equity |  US$3.96 billion (2023) |
Number of employees | 28,700 (2023) |
| Website | amkor |
| Footnotes / references [3][4] | |
With factories in China, Japan, Korea, Malaysia, Philippines, Portugal, Taiwan and Vietnam, Amkor is a major player in the semiconductor industry. It designs, packages and tests integrated circuits (ICs) for chip manufacturers.
Etymology
editAmkor self-publishes that the name "Amkor" is a portmanteau of the words "America" and "Korea".[7]
History
editAmkor's origins can be traced back to ANAM Industries, a business in Seoul dealing with imported Japanese goods, including bicycles, and founded by Hyang-Soo Kim in 1935. In March 1968, ANAM Industries underwent a transformation into ANAM Industrial Co. Ltd., becoming South Korea's first semiconductor business. One month later, his son Joo-Jin (James) Kim founded Amkor Electronics, Inc. and inaugurated its sales office in Philadelphia. Its semiconductor production and export began in 1970. In 1998, Amkor began publicly trading on Nasdaq.[7]
In 2000, Amkor acquired Integra Technologies, an Outsourced Semiconductor Assembly And Test (OSAT) provider in United States.[8] In 2005, Amkor spun off Integra Technologies.[9]
In February 2016, Amkor fully acquired J-Devices Corp, the largest Outsourced Semiconductor Assembly And Test (OSAT) provider in Japan.[10]
In June 2017, Amkor Technology was recognized as Supplier of the Year for 2016 by Qualcomm Technologies for a second consecutive year.[11]
Amkor Technology has competitiveness for chip assembly by thermal compression as well as wafer level packaging. In September 2018, Amkor Technology opened a manufacturing and test plant at Longtan Science Park in Taiwan.[12]
In 2019, Amkor Technology was ranked 2nd in overall revenue in the OSAT (Outsourced Semiconductor Assembly and Test) market.
- ASE Technology – $11.87 Billion
- Amkor Technology – $7.1 Billion
- JCET – $3.97 Billion
- SPIL – $2.79 Billion
- Powertech Technology – $2.17 Billion
A $2 billion factory for advanced packaging of chips from TSMC in Arizona was announced in November 2023.[13]
Products
editAmkors designs, packages and tests semiconductors for other companies. The company's offers include RF-antenna designs incorporated directly into or onto a chip,[14] CMOS imaging sensors[15] or flip chip packaging with copper pillars bumps.[16][17] Amkor also offers wire bonding of semiconductors to packages[18] as well as a technology to prevent edge gaps and cracks on semiconductor packaging called "Edge Protection".[19][20]
See also
edit
References
edit- ^ "Giel Rutten".
- ^ Jeff Gifford (June 18, 2020). "Valley semiconductor company names new CEO". Phoenix Business Journal.
- ^ "Amkor Technology – Company History". Retrieved 2018-01-08.
- ^ "US SEC: Form 10-K 2013". U.S. Securities and Exchange Commission. February 16, 2024. Retrieved February 17, 2024.
- ^ EE Times. “Amkor's outlook improved as it moves headquarters.” June 3, 2005. Retrieved April 19, 2016.
- ^ "Amkor relocates to Arizona - Philadelphia Business Journal". 2023-12-05. Archived from the original on 2023-12-05. Retrieved 2023-12-05.
- ^ a b "Company History". Amkor Technology. Retrieved January 27, 2024.
- ^ "2000 Annual Report". Amkor Technology. 2001. Archived from the original on February 9, 2023.
- ^ "Amkor spin-off Integra focuses on test". EE Times. October 10, 2005. Archived from the original on February 9, 2023.
- ^ By Hayley Ringle, Phoenix Business Journal. “Amkor Tech finishes 100 percent buy of a Japanese semiconductor company.” February 11, 2016. Retrieved December 21, 2016.
- ^ "Amkor Technology Recognized as Supplier of the Year for Second Consecutive Year by Qualcomm". Bloomberg.com. 15 June 2017. Archived from the original on 2020-03-17. Retrieved 2020-03-17.
- ^ "Amkor opens new semiconductor package manufacturing and test plant in Taiwan | Solid State Technology". electroiq.com. Retrieved 2018-09-25.
- ^ "Amkor to build $2 billion Arizona semiconductor packaging plant". reuters.com. 2023-11-30. Retrieved 2023-12-20.
- ^ "FAQ: Antenna-in-package answers the "last mile" RF challenge, Part 2". 5gtechnologyworld.com. 2023-06-06. Retrieved 2024-10-23.
- ^ "Amkor claims 13% of outsourced CMOS image sensor packaging". eetimes.com. 2002-11-05. Retrieved 2024-10-23.
- ^ "Amkor Technology and Texas Instruments Deliver Industry's First Fine Pitch Copper Pillar Flip Chip Packages to Market". techonline.com. Retrieved 2024-10-23.
- ^ "Amkor looks to EU CHIPS Act for semiconductor packaging in Portugal". eenewseurope.com. 2022-10-25. Retrieved 2024-10-23.
- ^ "Wirebonding Is Here To Stay". semiengineering.com. 2023-10-19. Retrieved 2024-10-23.
- ^ "Enhancing Punch MLF Packaging with Edge Protection Technology". semiengineering.com. 2023-06-14. Retrieved 2024-10-23.
- ^ "Amkor's Edge Protection™ Technology" (PDF). semiconductorpackagingnews.com. Retrieved 2024-10-23.
External links
edit- Official website
- Business data for Amkor Technology Inc.: